Research Article算电协同
Chandan Chaudhary、Michael Murillo、Mohammed Ben-Idris、Joydeep Mitra、Dilip Pandit、Atri Bera
Published 2026-06-12 · arXiv · Credibility S
Hyperscale AI data centers induce spatially and temporally correlated load fluctuations that violate classical independence assumptions and are not captured by time-averaged spectral methods. These correlations are episodic and non-stationary, requiring analysis that resolves transient structure. This paper applies Dynamic Mode Decomposition (DMD) to the temporal evolution of pairwise inter-bus correlation coefficie…
Abstract, interpretation and reference
Abstract
Hyperscale AI data centers induce spatially and temporally correlated load fluctuations that violate classical independence assumptions and are not captured by time-averaged spectral methods. These correlations are episodic and non-stationary, requiring analysis that resolves transient structure. This paper applies Dynamic Mode Decomposition (DMD) to the temporal evolution of pairwise inter-bus correlation coefficients to form a low-dimensional state representation that enables modal analysis without a stationarity assumption. DMD eigenvalues encode the correlation regime: their location in the complex plane distinguishes sustained coherence, decaying transients, and intensifying events, while oscillation frequency maps to underlying physical coupling mechanisms. Using an IEEE 39-bus Real-Time Digital Simulator (RTDS) testbed with three converter-interfaced AI data center loads driven by synthetic workload profiles, global DMD provides a time-averaged modal baseline in a slow thermal band ($f \approx 0.005$\,Hz, $|μ| = 0.91$) captures 93.6\% of total correlation energy. A sliding-window DMD formulation identifies transient intensification events: 51 of 775 windows (6.6\%) satisfy the $|μ_k^{(n)}| > 1$ criterion, which aligns with stochastic workload coincidences. Cross-validation with RTDS voltage coherence confirms elevated coupling during these intervals. The proposed modal growth indicator provides an early-warning signal of correlation intensification prior to peak pairwise coherence.
中文解读
背景：AI 数据中心负载、功率密度和能源约束同步上升，算力负载与电网侧资源的协同调度正在成为智算中心设计的关键变量。问题：论文聚焦现有方案在效率、可靠性或工程协同上的瓶颈。方法：摘要显示作者采用仿真建模和情景分析，把运行负载、冷却/能源系统和基础设施约束放在同一分析框架中。结果：研究重点指向跨地域数据中心负载与电力资源之间的调度关系。意义：对日报读者而言，它可用于判断智算中心建设是否受电网容量、负载波动和调度机制约束。仍需结合全文实验条件、样本范围和成本假设核验。
参考文献
Chandan Chaudhary, Michael Murillo, Mohammed Ben-Idris, 等. Modal Analysis of Spatial Load Correlation in AI Data Center-Dominated Power Systems[J/OL]. (2026-06-12)[2026-06-20]. http://arxiv.org/abs/2606.13847v1.
Research ArticleAI 运维优化
Linhan Fang、Xingpeng Li
Published 2026-06-01 · arXiv · Credibility S
With the increasing demand for edge computing and AI-driven workloads, integrating small and medium-sized edge data centers into distribution networks has become increasingly important. This paper investigates the hosting capacity of distribution networks for data center integration and identifies the key physical mechanisms that limit the maximum allowable data center load. The baseline analysis shows that data cen…
Abstract, interpretation and reference
Abstract
With the increasing demand for edge computing and AI-driven workloads, integrating small and medium-sized edge data centers into distribution networks has become increasingly important. This paper investigates the hosting capacity of distribution networks for data center integration and identifies the key physical mechanisms that limit the maximum allowable data center load. The baseline analysis shows that data center hosting capacity varies significantly across candidate buses due to network topology and electrical distance. Three dominant limiting mechanisms are identified: current-constrained locations, voltage-constrained locations, and mixed-constrained locations where both current loading and voltage deviation jointly affect hosting capacity. To increase the hosting capacity, this study evaluates multiple flexible resources, including battery energy storage systems (BESS), dispatchable distributed generators (DDG), and static synchronous compensators (STATCOM). Numerical results demonstrate that these resources provide complementary benefits through active power support, sustained local generation, and reactive power compensation, effectively expanding data center hosting capacity in distribution systems.
中文解读
背景：AI 数据中心负载、功率密度和能源约束同步上升，AI 运维、负载预测和设施调优正在成为智算中心设计的关键变量。问题：论文聚焦现有方案在效率、可靠性或工程协同上的瓶颈。方法：摘要显示作者采用仿真建模和情景分析，把运行负载、冷却/能源系统和基础设施约束放在同一分析框架中。结果：研究重点指向跨地域数据中心负载与电力资源之间的调度关系。意义：对日报读者而言，它可用于判断AI 工具是否能降低运维复杂度并提升可用性。仍需结合全文实验条件、样本范围和成本假设核验。
参考文献
Linhan Fang, Xingpeng Li. Hosting Capacity Assessment and Enhancement for Edge Data Centers in Active Distribution Networks[J/OL]. (2026-06-01)[2026-06-20]. http://arxiv.org/abs/2606.01407v1.
Research Article芯片与算力
Ehsan K. Ardestani、Leonardo Piga、Jovan Stojkovic、Pavan Balaji、Mustafa Ozdal、Mikel Jimenez Fernandez、Mihaela Dimovska、Luka Tadic
Published 2026-05-23 · arXiv · Credibility S
The electric power supply for AI data centers is now the most significant bottleneck in the race toward Artificial General Intelligence, surpassing even the constraint of AI accelerator availability. To our knowledge, this paper is the first to describe the end-to-end power management process for a hyper-scale AI datacenter; from early power planning to accommodate next-generation accelerators 6--12 months before th…
Abstract, interpretation and reference
Abstract
The electric power supply for AI data centers is now the most significant bottleneck in the race toward Artificial General Intelligence, surpassing even the constraint of AI accelerator availability. To our knowledge, this paper is the first to describe the end-to-end power management process for a hyper-scale AI datacenter; from early power planning to accommodate next-generation accelerators 6--12 months before their general availability, to tuning power settings after large scale deployment, and finally to dynamic, runtime power management for evolving workloads. We present detailed power measurements for a 150 MW datacenter hosting a cluster of 83K GB200 GPUs. We share insights from building this state-of-the-art AI cluster. We hope this work encourages practitioners across the industry to share their own experiences as well.
中文解读
背景：AI 数据中心负载、功率密度和能源约束同步上升，芯片、服务器和高密度算力部署正在成为智算中心设计的关键变量。问题：论文聚焦现有方案在效率、可靠性或工程协同上的瓶颈。方法：摘要显示作者采用建模优化、调度分析或算法评估，把运行负载、冷却/能源系统和基础设施约束放在同一分析框架中。结果：研究重点指向跨地域数据中心负载与电力资源之间的调度关系。意义：对日报读者而言，它可用于判断芯片路线和服务器密度变化如何传导到机房设计。仍需结合全文实验条件、样本范围和成本假设核验。
参考文献
Ehsan K. Ardestani, Leonardo Piga, Jovan Stojkovic, 等. Provisioning to Runtime Optimization of a 100 MW-Scale AI Cluster[J/OL]. (2026-05-23)[2026-06-20]. http://arxiv.org/abs/2605.24461v2.
Research Article热管理与液冷
Jiajing Nie、Jiuyang Tang、Hao Guan、Xinyue Wang、Tao Jiang、Junran Zhang、Guoqi Zhang、Guangyin Lei
Published 2026-05-26 · Semantic Scholar · Credibility S
Semantic Scholar 未提供可展示的原文摘要；请打开论文链接查看全文摘要。
Abstract, interpretation and reference
Abstract
Semantic Scholar 未提供可展示的原文摘要；请打开论文链接查看全文摘要。
中文解读
背景：AI 数据中心负载、功率密度和能源约束同步上升，液冷、热管理和数据中心能效正在成为智算中心设计的关键变量。问题：论文聚焦现有方案在效率、可靠性或工程协同上的瓶颈。方法：摘要显示作者采用文献摘要中的模型、实验或案例分析，把运行负载、冷却/能源系统和基础设施约束放在同一分析框架中。结果：研究重点指向冷却效率、能源利用或运维策略的改进方向。意义：对日报读者而言，它可用于判断液冷方案、热管理路线和高密度部署节奏。摘要缺失，建议优先打开原文查看方法、数据和边界条件。
参考文献
Jiajing Nie, Jiuyang Tang, Hao Guan, 等. Wafer-Level Integrated 1200 V SiC MOSFET Package with Room-Temperature Wafer Bonding and Embedded Microfluidic Cooling[J/OL]. Electronic Components and Technology Conference. (2026-05-26)[2026-06-20]. https://www.semanticscholar.org/paper/11fa662b073d777b3f9125fd8ef8a3bb5cf601cc.
Research Article算电协同
Amir Sajadi、Muhy Eddin Za'ter、Maria Vabson、Kyri Baker、Bri-Mathias Hodge
Published 2026-05-31 · arXiv · Credibility S
This article addresses recent advances in artificial intelligence, which have set off an astounding race among technology frontiers to build large data centers. It provides insights into impacts of large data centers on the planning and operation of the power grid.
Abstract, interpretation and reference
Abstract
This article addresses recent advances in artificial intelligence, which have set off an astounding race among technology frontiers to build large data centers. It provides insights into impacts of large data centers on the planning and operation of the power grid.
中文解读
背景：AI 数据中心负载、功率密度和能源约束同步上升，算力负载与电网侧资源的协同调度正在成为智算中心设计的关键变量。问题：论文聚焦现有方案在效率、可靠性或工程协同上的瓶颈。方法：摘要显示作者采用文献摘要中的模型、实验或案例分析，把运行负载、冷却/能源系统和基础设施约束放在同一分析框架中。结果：研究重点指向AI 负载波动对电网设备寿命和调频边界的影响。意义：对日报读者而言，它可用于判断智算中心建设是否受电网容量、负载波动和调度机制约束。仍需结合全文实验条件、样本范围和成本假设核验。
参考文献
Amir Sajadi, Muhy Eddin Za'ter, Maria Vabson, 等. Power Grid Infrastructure for AI Data Centers[J/OL]. (2026-05-31)[2026-06-20]. http://arxiv.org/abs/2606.00941v1.
Research Article芯片与算力
Sohan Salahuddin Mugdho、Md. Shahedul Hasan、Cheng Wang
Published 2026-06-04 · arXiv · Credibility S
The rapid growth in compute demand from artificial intelligence (AI) has driven a massive surge in data center construction, precipitating an energy and sustainability crisis. Motivated by the abundant solar energy in outer space and the recent sharp reduction in space launch costs, orbital data centers are emerging as a potential pathway for the future scaling of AI compute infrastructure. While the cold background…
Abstract, interpretation and reference
Abstract
The rapid growth in compute demand from artificial intelligence (AI) has driven a massive surge in data center construction, precipitating an energy and sustainability crisis. Motivated by the abundant solar energy in outer space and the recent sharp reduction in space launch costs, orbital data centers are emerging as a potential pathway for the future scaling of AI compute infrastructure. While the cold background in vacuum seems appealing for cooling, computing systems operating in space without convection ultimately rely on radiative cooling, requiring large-area radiators. Such limitations in thermal management pose a significant challenge for deploying the standard liquid/air-cooled computers in space. In this work, we investigate the impact of the thermal constraints in space on both graphics processing units (GPUs) with high-bandwidth memory (HBM) and the emerging compute-in-memory (CIM) accelerators. We develop a radiator-in-the-loop co-design methodology that directly links the permitted system TOPS (terra-operations per second) with the practical radiator cooling capacity in space. Our thermal simulations reveal that the separately located GPU die and HBMs create severe thermal hotspots under limited radiator capacity, necessitating GPU thermal throttling. In contrast, CIM accelerators exhibit a much more uniform heat distribution and consistently outperform GPUs in TOPS/W across a wide range of radiator budgets. We systematically evaluated the performance of CIM and GPU across various AI workloads and demonstrated that CIM has a magnified advantage for deployment in space under realistic thermal constraints.
中文解读
背景：AI 数据中心负载、功率密度和能源约束同步上升，芯片、服务器和高密度算力部署正在成为智算中心设计的关键变量。问题：论文聚焦现有方案在效率、可靠性或工程协同上的瓶颈。方法：摘要显示作者采用综述归纳和指标比较，把运行负载、冷却/能源系统和基础设施约束放在同一分析框架中。结果：研究重点指向跨地域数据中心负载与电力资源之间的调度关系。意义：对日报读者而言，它可用于判断芯片路线和服务器密度变化如何传导到机房设计。仍需结合全文实验条件、样本范围和成本假设核验。
参考文献
Sohan Salahuddin Mugdho, Md. Shahedul Hasan, Cheng Wang. Space-CIM: Enabling Compute-In-Memory Accelerators for Thermally-Constrained Space Platforms[J/OL]. (2026-06-04)[2026-06-20]. http://arxiv.org/abs/2606.05741v1.
Research Article算电协同
Soham Ghosh、Anik Goswami、Krishna Kumba
Published 2026-06-11 · arXiv · Credibility S
Floating solar photovoltaic (FSPV) systems provide a land-efficient pathway to expand clean electricity access in energy-poor regions. South America has among the highest global FSPV potential (approx 38.26 TWh per million acres of water surface), yet deployment remains limited. This study presents a techno-socio-economic framework to assess FSPV for energy access, water security, and grid flexibility, with case stu…
Abstract, interpretation and reference
Abstract
Floating solar photovoltaic (FSPV) systems provide a land-efficient pathway to expand clean electricity access in energy-poor regions. South America has among the highest global FSPV potential (approx 38.26 TWh per million acres of water surface), yet deployment remains limited. This study presents a techno-socio-economic framework to assess FSPV for energy access, water security, and grid flexibility, with case studies in Nicaragua, Honduras, and Guyana. Estimated yields for 50 to 398 MW systems exceed 1,500 to 2,000 kWh per kW annually with capacity factors above 20 percent. At El Cajon, FSPV could significantly reduce emissions relative to fossil generation. Results show competitive costs with land-based PV when accounting for avoided land use, shared hydropower infrastructure, and water benefits. The framework also highlights co-location with hydropower and AI data centers, offering a scalable model for deployment in underserved regions.
中文解读
背景：AI 数据中心负载、功率密度和能源约束同步上升，算力负载与电网侧资源的协同调度正在成为智算中心设计的关键变量。问题：论文聚焦现有方案在效率、可靠性或工程协同上的瓶颈。方法：摘要显示作者采用框架构建和频域/系统级分析，把运行负载、冷却/能源系统和基础设施约束放在同一分析框架中。结果：研究重点指向AI 负载波动对电网设备寿命和调频边界的影响。意义：对日报读者而言，它可用于判断智算中心建设是否受电网容量、负载波动和调度机制约束。仍需结合全文实验条件、样本范围和成本假设核验。
参考文献
Soham Ghosh, Anik Goswami, Krishna Kumba. Pushing the Frontiers for Floating Solar Photovoltaics -- The Case for South America[J/OL]. (2026-06-11)[2026-06-20]. http://arxiv.org/abs/2606.12798v1.
Research Article芯片与算力
Mohamed M. Morsy
Published 2026-06-15 · Semantic Scholar · Credibility S
The rapid growth of artificial intelligence (AI) workloads is reshaping semiconductor design across architecture, interconnect, memory hierarchy, packaging, timing, and design automation. Rather than converging on a single hardware solution, the field is expanding into a heterogeneous ecosystem that includes data-center graphics processing units (GPUs), edge neural processing units (NPUs), and application-specific i…
Abstract, interpretation and reference
Abstract
The rapid growth of artificial intelligence (AI) workloads is reshaping semiconductor design across architecture, interconnect, memory hierarchy, packaging, timing, and design automation. Rather than converging on a single hardware solution, the field is expanding into a heterogeneous ecosystem that includes data-center graphics processing units (GPUs), edge neural processing units (NPUs), and application-specific integrated circuits (ASICs), field-programmable gate array (FPGA)-based and hybrid AI system-on-chip (SoC) platforms, chiplet-enabled systems, and emerging beyond-conventional-silicon approaches such as photonic, neuromorphic, and analog in-memory processors. This paper presents a comprehensive review of AI-on-chip systems from a cross-layer perspective. It examines AI chip architectures and hardware platforms, network-on-chip (NoC) designs for AI communication patterns, and algorithm–hardware co-design methods for model acceleration, including compression, quantization, and sparsity-aware optimization. It also reviews clocking, synchronization, and clock-domain-crossing (CDC) challenges in large heterogeneous systems and chiplets, as well as manufacturing, advanced packaging, and reliability issues, including two-and-a-half-dimensional (2.5D) and three-dimensional (3D) integration, thermal and mechanical constraints, assembly quality, and long-term yield considerations. In parallel, the paper surveys the growing role of AI in chip design itself, covering machine-learning-assisted analysis, Bayesian and reinforcement-learning-based optimization, and the emerging use of large language models (LLMs) and AI agents for register-transfer level (RTL) generation, design-space exploration, and autonomous electronic design automation (EDA) workflows. Finally, it discusses beyond-silicon AI chip directions and the broader economic and industry context shaping cloud, on-premises, and edge deployment. By integrating these topics into a unified framework, this review highlights the key technological drivers, system-level tradeoffs, and future research directions that will define next-generation scalable, reliable, and energy-efficient AI-on-chip systems.
中文解读
背景：AI 数据中心负载、功率密度和能源约束同步上升，芯片、服务器和高密度算力部署正在成为智算中心设计的关键变量。问题：论文聚焦现有方案在效率、可靠性或工程协同上的瓶颈。方法：摘要显示作者采用综述归纳和指标比较，把运行负载、冷却/能源系统和基础设施约束放在同一分析框架中。结果：研究重点指向跨地域数据中心负载与电力资源之间的调度关系。意义：对日报读者而言，它可用于判断芯片路线和服务器密度变化如何传导到机房设计。仍需结合全文实验条件、样本范围和成本假设核验。
参考文献
Mohamed M. Morsy. AI-on-Chip Systems: A Cross-Layer Review of Architectures, Interconnects, Design Automation, and Embedded Intelligence[J/OL]. Electronics. (2026-06-15)[2026-06-20]. https://www.semanticscholar.org/paper/6559f17a3e4aaa83cbf55ab2f8c0657056399288.
