Research Article芯片与算力
Woohyun Park、Youchang Na、S. Hong、Yoko Tomo、H. Yu、Yanggyoo Jung、Gyungbum Kim、H. Kang
Published 2026-05-26 · Semantic Scholar · Credibility S
The scalability and long-term reliability of 2.5D System-in-Package (SiP) platforms are increasingly governed by complex thermal management requirements, particularly as the integration of High-Bandwidth Memory (HBM) introduces concentrated heat profiles that challenge the system’s operational limits. The package platform—Thermo-Compression Bonding (TCB) versus Hybrid Copper Bonding (HCB) of HBM—strongly influences …
Abstract, interpretation and reference
Abstract
The scalability and long-term reliability of 2.5D System-in-Package (SiP) platforms are increasingly governed by complex thermal management requirements, particularly as the integration of High-Bandwidth Memory (HBM) introduces concentrated heat profiles that challenge the system’s operational limits. The package platform—Thermo-Compression Bonding (TCB) versus Hybrid Copper Bonding (HCB) of HBM—strongly influences intra- and inter-package thermal behavior. This work implements 2.5D system-in-package (SiP) thermal test vehicles (TTVs) in an Open Compute Project (OCP)-standard GPU server with embedded sensors and controllable heaters across HBM stacks and GPU dies, faithfully mirroring functional heterogeneous package floorplans. Experimental results demonstrate thermal nonlinearity - strong platform- and cooling-dependent. At 1030 W per package, HCB reduces intra-package GPU to HBM thermal crosstalk versus TCB by 2.2% under air cooling and 9.8% under liquid cooling, while inter-package thermal crosstalk varies by up to 13.7% across cooling conditions. Comparative evaluation confirms that HCB measurably improves thermal conduction, reducing both intra- and inter-package thermal resistance. From a data-center perspective, the reduction in GPU to HBM crosstalk resistance enables up to 0.9°C higher allowable coolant inlet temperature in liquid cooling relative to the TCB baseline, which translates to approximately 3% cooling power reduction and PUE improvement from 1.26 to 1.24. For a 1000-rack AI cluster, this corresponds to roughly 31 GWh annual energy savings. Measured thermal trends further indicate that as AI infrastructure evolves toward inference-heavy, memory-focused workloads with increased HBM base-die power, HCB platforms will deliver progressively larger thermal benefits due to the shift toward more vertical-resistance-limited behavior. This study establishes GPU server-integrated 2.5D SiP TTV methodology as a robust platform for system-level thermal validation and demonstrates that HBM platform selection directly impacts data-center operational efficiency and future inference scalability.
中文解读
背景：AI 数据中心负载、功率密度和能源约束同步上升，芯片、服务器和高密度算力部署正在成为智算中心设计的关键变量。问题：论文聚焦现有方案在效率、可靠性或工程协同上的瓶颈。方法：摘要显示作者采用实验验证、原型测试或测量对比，把运行负载、冷却/能源系统和基础设施约束放在同一分析框架中。结果：研究重点指向能效评价口径、运营指标和优化目标的系统化梳理。意义：对日报读者而言，它可用于判断芯片路线和服务器密度变化如何传导到机房设计。仍需结合全文实验条件、样本范围和成本假设核验。
参考文献
Woohyun Park, Youchang Na, S. Hong, 等. System-Level Thermal Validation of 2.5D Packages in GPU Servers: Impact of TCB vs HCB HBM Platforms[J/OL]. Electronic Components and Technology Conference. (2026-05-26)[2026-06-25]. https://www.semanticscholar.org/paper/2ca4f8beb1ea19fe6d038cdee022de662a80ecd6.
Research Article算电协同
Yijie Yang、Xi Weng、Yue Chen
Published 2026-06-16 · arXiv · Credibility S
The rapid growth of AI workloads is substantially increasing data center electricity demand and carbon emissions, motivating the development of carbon-aware scheduling methods. However, effective scheduling is challenging because renewable generation and AI workloads are subject to forecast errors, while training and inference workloads exhibit heterogeneity in computational characteristics. This paper proposes a co…
Abstract, interpretation and reference
Abstract
The rapid growth of AI workloads is substantially increasing data center electricity demand and carbon emissions, motivating the development of carbon-aware scheduling methods. However, effective scheduling is challenging because renewable generation and AI workloads are subject to forecast errors, while training and inference workloads exhibit heterogeneity in computational characteristics. This paper proposes a contextual robust optimization framework for AI data center operation. The proposed model explicitly captures the heterogeneous computational characteristics of AI training and inference workloads. To deal with renewable generation and workload forecast errors, we develop loss-based uncertainty learning models that directly map contextual features to covariate-dependent uncertainty sets. The resulting contextual joint chance-constrained scheduling problem is reformulated into a tractable robust optimization problem, and a calibration algorithm is developed to provide finite-sample probabilistic feasibility guarantees for multiple joint chance constraints. Numerical experiments based on real-world AI workload traces and renewable generation data show that the proposed method reduces operating costs by an average of 5.57% compared to benchmark methods while maintaining reliable feasibility and strong computational scalability.
中文解读
背景：AI 数据中心负载、功率密度和能源约束同步上升，算力负载与电网侧资源的协同调度正在成为智算中心设计的关键变量。问题：论文聚焦现有方案在效率、可靠性或工程协同上的瓶颈。方法：摘要显示作者采用建模优化、调度分析或算法评估，把运行负载、冷却/能源系统和基础设施约束放在同一分析框架中。结果：研究重点指向跨地域数据中心负载与电力资源之间的调度关系。意义：对日报读者而言，它可用于判断智算中心建设是否受电网容量、负载波动和调度机制约束。仍需结合全文实验条件、样本范围和成本假设核验。
参考文献
Yijie Yang, Xi Weng, Yue Chen. Contextual Robust Optimization for AI Data Center Scheduling with Statistical Guarantees[J/OL]. (2026-06-16)[2026-06-25]. http://arxiv.org/abs/2606.17466v1.
Research Article余热回收
Shrenik Jadhav、Vidhyashree Nagaraju、Zheng Liu
Published 2026-06-14 · arXiv · Credibility S
Liquid cooled supercomputers dissipate tens of megawatts of waste heat through cooling plants organized as parallel subloops that serve coolant distribution units. The number of subloops and the assignment of units to them are design decisions fixed at construction, yet they have not been systematically optimized for facilities at this scale. As electricity grids decarbonize, embodied carbon becomes a larger share o…
Abstract, interpretation and reference
Abstract
Liquid cooled supercomputers dissipate tens of megawatts of waste heat through cooling plants organized as parallel subloops that serve coolant distribution units. The number of subloops and the assignment of units to them are design decisions fixed at construction, yet they have not been systematically optimized for facilities at this scale. As electricity grids decarbonize, embodied carbon becomes a larger share of facility life cycle emissions and the cost of an unnecessary subloop becomes harder to justify. We present a framework that integrates operational energy from a validated control optimizer based on sequential least squares programming, embodied carbon from a bill of materials, and expected unplanned downtime from a per subloop reliability model. The framework is applied to the Frontier supercomputer, evaluating all 611 ways of partitioning its 25 coolant distribution units into two through six subloops. The life cycle cost and carbon optimum is found at two subloops holding 14 and 11 units, achieving 3,320.7 tonnes of carbon dioxide equivalent and $3.99 million over a seven year horizon, a saving of 50.2 tonnes and $100,000 compared to built four subloop configuration. The optimum remains on the Pareto front in all 15 scenarios of a one at a time sensitivity sweep. A semi-analytical decision rule generalizes the result, predicting four subloops for Aurora, two for El Capitan, and one for LUMI. When reliability is treated as a hard constraint set by operations policy, the four subloop Frontier deployment is consistent with the constrained optimum.
中文解读
背景：AI 数据中心负载、功率密度和能源约束同步上升，余热回收、热泵耦合和二次能源利用正在成为智算中心设计的关键变量。问题：论文聚焦现有方案在效率、可靠性或工程协同上的瓶颈。方法：摘要显示作者采用综述归纳和指标比较，把运行负载、冷却/能源系统和基础设施约束放在同一分析框架中。结果：研究重点指向AI 负载波动对电网设备寿命和调频边界的影响。意义：对日报读者而言，它可用于判断数据中心余热能否从成本项转化为能源资产。仍需结合全文实验条件、样本范围和成本假设核验。
参考文献
Shrenik Jadhav, Vidhyashree Nagaraju, Zheng Liu. Data Center Life Cycle Co-Design Optimization[J/OL]. (2026-06-14)[2026-06-25]. http://arxiv.org/abs/2606.15408v1.
Research Article芯片与算力
Jiajing Nie、Jiuyang Tang、Hao Guan、Xinyue Wang、Tao Jiang、Junran Zhang、Guoqi Zhang、Guangyin Lei
Published 2026-05-26 · Semantic Scholar · Credibility S
The rising demand for high-power semiconductor devices in sectors such as electric vehicles (EVs), renewable energy conversion, and data centers highlights the need for efficient and reliable thermal management technologies. In this work, we present a simulation-based study of a 1200 V SiC MOSFET wafer-level power package that integrates chip–package co-design, room-temperature wafer bonding, and embedded microfluid…
Abstract, interpretation and reference
Abstract
The rising demand for high-power semiconductor devices in sectors such as electric vehicles (EVs), renewable energy conversion, and data centers highlights the need for efficient and reliable thermal management technologies. In this work, we present a simulation-based study of a 1200 V SiC MOSFET wafer-level power package that integrates chip–package co-design, room-temperature wafer bonding, and embedded microfluidic cooling. By utilizing a room-temperature bonding process to mitigate fabrication-induced warpage and optimizing the chip geometry to balance thermal spreading with mechanical stress, this proposed architecture ensures structural integrity while maximizing heat transfer efficiency. Thermal-fluid-mechanical multiphysics modeling results revealed that the proposed wafer-level microfluidic package achieved a 35.14% reduction in total thermal resistance compared with conventional SiC MOSFET power modules. The design demonstrates improvements in junction temperature uniformity and overall heat dissipation efficiency, which is promising for next-generation high-power density applications.
中文解读
背景：AI 数据中心负载、功率密度和能源约束同步上升，芯片、服务器和高密度算力部署正在成为智算中心设计的关键变量。问题：论文聚焦现有方案在效率、可靠性或工程协同上的瓶颈。方法：摘要显示作者采用仿真建模和情景分析，把运行负载、冷却/能源系统和基础设施约束放在同一分析框架中。结果：研究重点指向算力硬件、边缘计算或模型部署对基础设施的牵引。意义：对日报读者而言，它可用于判断芯片路线和服务器密度变化如何传导到机房设计。仍需结合全文实验条件、样本范围和成本假设核验。
参考文献
Jiajing Nie, Jiuyang Tang, Hao Guan, 等. Wafer-Level Integrated 1200 V SiC MOSFET Package with Room-Temperature Wafer Bonding and Embedded Microfluidic Cooling[J/OL]. Electronic Components and Technology Conference. (2026-05-26)[2026-06-25]. https://www.semanticscholar.org/paper/11fa662b073d777b3f9125fd8ef8a3bb5cf601cc.
Research Article算电协同
Chandan Chaudhary、Alaaeldein Abdelkader、Yansong Pei、Mohammed Benidris、Joydeep Mitra
Published 2026-06-12 · arXiv · Credibility S
The proliferation of large-scale data centers introduces spatially correlated demand profiles that challenge the long-standing assumption of statistical independence of loads in power system analysis. This paper examines the emergence of such load correlations and evaluates their impact on data-center-dominated grids. Analytical derivations reveal that correlated load fluctuations amplify aggregate stochastic distur…
Abstract, interpretation and reference
Abstract
The proliferation of large-scale data centers introduces spatially correlated demand profiles that challenge the long-standing assumption of statistical independence of loads in power system analysis. This paper examines the emergence of such load correlations and evaluates their impact on data-center-dominated grids. Analytical derivations reveal that correlated load fluctuations amplify aggregate stochastic disturbances, reduce voltage stability margins through weakened reactive power stiffness, and degrade frequency stability margin by erosion of natural load diversity effects. Real-time digital simulation studies confirm that moderate spatial correlation in distributed data centers produces simultaneous frequency deviations and voltage fluctuations across multiple buses. The findings offer transmission system operators a physics-based perspective to interpret emerging oscillatory phenomena and establish stability planning criteria grounded in measurable load-correlation structures rather than traditional diversity assumptions.
中文解读
背景：AI 数据中心负载、功率密度和能源约束同步上升，算力负载与电网侧资源的协同调度正在成为智算中心设计的关键变量。问题：论文聚焦现有方案在效率、可靠性或工程协同上的瓶颈。方法：摘要显示作者采用仿真建模和情景分析，把运行负载、冷却/能源系统和基础设施约束放在同一分析框架中。结果：研究重点指向AI 负载波动对电网设备寿命和调频边界的影响。意义：对日报读者而言，它可用于判断智算中心建设是否受电网容量、负载波动和调度机制约束。仍需结合全文实验条件、样本范围和成本假设核验。
参考文献
Chandan Chaudhary, Alaaeldein Abdelkader, Yansong Pei, 等. Spatial Load Correlation in AI Data-Center-Dominated Power Systems[J/OL]. (2026-06-12)[2026-06-25]. http://arxiv.org/abs/2606.13853v1.
Research Article芯片与算力
Feng Zhou、Wenlong Gu、Wenlong Li、G. Ma
Published 2026-06-01 · Semantic Scholar · Credibility S
Semantic Scholar 未提供可展示的原文摘要；请打开论文链接查看全文摘要。
Abstract, interpretation and reference
Abstract
Semantic Scholar 未提供可展示的原文摘要；请打开论文链接查看全文摘要。
中文解读
背景：AI 数据中心负载、功率密度和能源约束同步上升，芯片、服务器和高密度算力部署正在成为智算中心设计的关键变量。问题：论文聚焦现有方案在效率、可靠性或工程协同上的瓶颈。方法：摘要显示作者采用文献摘要中的模型、实验或案例分析，把运行负载、冷却/能源系统和基础设施约束放在同一分析框架中。结果：研究重点指向算力硬件、边缘计算或模型部署对基础设施的牵引。意义：对日报读者而言，它可用于判断芯片路线和服务器密度变化如何传导到机房设计。摘要缺失，建议优先打开原文查看方法、数据和边界条件。
参考文献
Feng Zhou, Wenlong Gu, Wenlong Li, 等. Heat transfer and flow characteristics of bionic Victoria Amazonica liquid cooling plate for thermal management of chips in data centers[J/OL]. International Communications in Heat and Mass Transfer. (2026-06-01)[2026-06-25]. https://www.semanticscholar.org/paper/11f6857398316b362b30dcdbd0b233df7100bb1e.
Research Article算电协同
Bojun Du、Xiaoyi Fan、Ershun Du、Long Chen、Jianpei Han、Qingchun Hou、Ning Zhang、Chongqing Kang
Published 2026-06-17 · arXiv · Credibility S
The rapid growth of large language model (LLM) inference is creating significant data-center loads that face increasing energy-management challenges under tightening grid conditions and demand response (DR) requirements. Conventional data-center energy management mainly relies on temporal and spatial workload shifting and campus-level energy asset scheduling, but it usually treats LLM inference demand as an aggregat…
Abstract, interpretation and reference
Abstract
The rapid growth of large language model (LLM) inference is creating significant data-center loads that face increasing energy-management challenges under tightening grid conditions and demand response (DR) requirements. Conventional data-center energy management mainly relies on temporal and spatial workload shifting and campus-level energy asset scheduling, but it usually treats LLM inference demand as an aggregate load. As a result, these approaches fail to exploit the internal characteristics of LLM serving and therefore overlook the flexibility offered by LLM-specific techniques such as model quantization. To unlock this flexibility, this paper proposes a quantization-enabled energy management framework for grid-responsive LLM inference data centers. First, a quantization-to-power model is established to map each model--quantization configuration to a compact set of dispatchable parameters. Second, a two-stage quantization-enabled DR model is developed to account for model instance switching, request routing, and precision selection. Third, a multi-campus co-optimization method is introduced for DR participation by integrating grid-side electricity and carbon signals with the quantization-enabled DR model. Case studies show that the proposed framework reduces total data-center operating cost by 34.3\% without curtailing served token volume, validating model quantization as an effective flexibility lever for grid-responsive LLM data-center energy management.
中文解读
背景：AI 数据中心负载、功率密度和能源约束同步上升，算力负载与电网侧资源的协同调度正在成为智算中心设计的关键变量。问题：论文聚焦现有方案在效率、可靠性或工程协同上的瓶颈。方法：摘要显示作者采用建模优化、调度分析或算法评估，把运行负载、冷却/能源系统和基础设施约束放在同一分析框架中。结果：研究重点指向AI 负载波动对电网设备寿命和调频边界的影响。意义：对日报读者而言，它可用于判断智算中心建设是否受电网容量、负载波动和调度机制约束。仍需结合全文实验条件、样本范围和成本假设核验。
参考文献
Bojun Du, Xiaoyi Fan, Ershun Du, 等. From Tokens to Energy Flexibility: Quantization-Enabled Demand Response for Data Centers with LLM Inference Workloads[J/OL]. (2026-06-17)[2026-06-25]. http://arxiv.org/abs/2606.18851v1.
Research Article算电协同
Denisa-Andreea Constantinescu、David Atienza
Published 2026-05-26 · arXiv · Credibility S
At global scale, data-center electricity demand is growing faster than the grids that supply it, while system operators increasingly require large flexible loads that can adjust power within seconds to absorb variable wind and solar generation. For multi-megawatt AI/HPC facilities, the key unresolved question is practical and measurable: how quickly can the software stack translate a grid request into a real change …
Abstract, interpretation and reference
Abstract
At global scale, data-center electricity demand is growing faster than the grids that supply it, while system operators increasingly require large flexible loads that can adjust power within seconds to absorb variable wind and solar generation. For multi-megawatt AI/HPC facilities, the key unresolved question is practical and measurable: how quickly can the software stack translate a grid request into a real change in GPU power at the facility meter, where commitments are settled? We answer this on real hardware with GridPilot, a three-tier predictive controller operating across milliseconds, seconds, and hours, augmented by a deterministic safety-island bypass for fast response. On a three-GPU NVIDIA V100 testbed, GridPilot achieves a measured end-to-end trigger-to-target response of 97.2 ms, which is 6.9x faster than the 700 ms requirement of Nordic Fast Frequency Reserve. We further incorporate an instantaneous Power Usage Effectiveness (PUE) correction so dispatched commitments remain robust at meter level rather than only at IT load level. In replay experiments across six representative European grids (from Sweden to Poland), the PUE-aware controller closes 2.5-5.8 percentage points of cooling-overhead drag. GridPilot is released as open source and serves as a proof of concept that MW-scale AI/HPC demand can be engineered as controllable, grid-responsive flexibility by design.
中文解读
背景：AI 数据中心负载、功率密度和能源约束同步上升，算力负载与电网侧资源的协同调度正在成为智算中心设计的关键变量。问题：论文聚焦现有方案在效率、可靠性或工程协同上的瓶颈。方法：摘要显示作者采用实验验证、原型测试或测量对比，把运行负载、冷却/能源系统和基础设施约束放在同一分析框架中。结果：研究重点指向AI 负载波动对电网设备寿命和调频边界的影响。意义：对日报读者而言，它可用于判断智算中心建设是否受电网容量、负载波动和调度机制约束。仍需结合全文实验条件、样本范围和成本假设核验。
参考文献
Denisa-Andreea Constantinescu, David Atienza. GridPilot: Real-Time Grid-Responsive Control for AI Supercomputers[J/OL]. (2026-05-26)[2026-06-25]. http://arxiv.org/abs/2605.26384v1.
